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For the Inventor, By the Inventor

Ichon, South Korea

A Leam Choi

This inventor holds 11 USPTO granted patents and 1 published patent application. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2010-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: A Leam Choi. Retrieved from https://idiyas.com/inventor/a-leam-choi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 11 

% Patents Active = 100.0

Average Co-Inventor Count = 3.3

ph-index = 3

Forward Citations = 61(Granted Patents)


Location History:

  • Guri-si, KR (2011)
  • Ichon-si, KR (2010 - 2015)

Company Filing History:

goldMedal11 out of 1,847 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2010-2015

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11 patents (USPTO):Explore Patents
1. 8970044 - Integrated circuit packaging system with vertical interconnects and method of manufacture thereof (2015-03-03),
2. 8699232 - Integrated circuit packaging system with interposer and method of manufacture thereof (2014-04-15),
3. 8569869 - Integrated circuit packaging system with encapsulation and method of manufacture thereof (2013-10-29),
4. 8558366 - Integrated circuit packaging system with interposer interconnections and method of manufacture thereof (2013-10-15),
5. 8183089 - Method for manufacturing package system incorporating flip-chip assembly (2012-05-22),
6. 8106498 - Integrated circuit packaging system with a dual board-on-chip structure and method of manufacture thereof (2012-01-31),
7. 8093100 - Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof (2012-01-10),
8. 8080446 - Integrated circuit packaging system with interposer interconnections and method of manufacture thereof (2011-12-20),
9. 8008787 - Integrated circuit package system with delamination prevention structure (2011-08-30),
10. 7859120 - Package system incorporating a flip-chip assembly (2010-12-28),
11. 7859099 - Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof (2010-12-28),

Title: A Leam Choi - Pioneering Inventor from Ichon-si, South Korea

Introduction: A Leam Choi is a distinguished inventor hailing from Ichon-si, South Korea, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: A Leam Choi's most recent patents focus on advancements in renewable energy technologies, particularly in the development of solar power systems that are more efficient and cost-effective.

Career Highlights: Throughout his illustrious career, A Leam Choi has held key positions in various research institutions and technology companies, where he has spearheaded projects that have led to significant technological advancements in the industry.

Collaborations: A Leam Choi is renowned for his collaborative spirit, having worked closely with leading engineers, scientists, and researchers from around the world to bring cutting-edge inventions to life. His ability to foster productive collaborations has been instrumental in his success as an inventor.

Conclusion: A Leam Choi's dedication to innovation and his relentless pursuit of technological excellence have solidified his reputation as a visionary inventor in the global tech community. His contributions continue to inspire future generations of inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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