The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2013
Filed:
Mar. 23, 2010
Applicants:
Hyungsang Park, Hanam-si, KR;
A Leam Choi, Ichon-si, KR;
Johyun Bae, Seoul, KR;
Inventors:
Assignee:
Stats Chippac Ltd., Singapore, SG;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 29/40 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit over a package carrier; mounting a rounded interconnect on the package carrier; mounting a conductive shield over the package carrier, the conductive shield having an elevated portion and a hole adjacent to the elevated portion with the elevated portion over the integrated circuit and the rounded interconnect exposed from the hole; and forming an encapsulation between the conductive shield and the package carrier with the rounded interconnect exposed.