HyungSang Park

This inventor holds 12 USPTO granted patents and 1 published patent application. Top assignees: Stats Chippac Pte. Ltd., Hyundai Mobis Co., Ltd.. Active years: 2009-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: HyungSang Park. Retrieved from https://idiyas.com/inventor/hyungsang-park

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 12 (Patent Applications = 1)

% Patents Active = 100.0

Average Co-Inventor Count = 2.8

ph-index = 4

Forward Citations = 73(Granted Patents)

Location History:

Hanam-si, KR (2010 - 2015)
Gyeonggi-do, KR (2009 - 2020)

Company Filing History:

11 out of 1,845

Stats Chippac Pte. Ltd.

patents

1 out of 2,668

Hyundai Mobis Co., Ltd.

patents

Years Active: 2009-2020

Loading Chart...

12 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10665662 - Semiconductor device and method of forming substrate including embedded component with symmetrical structure (2020-05-26),

2. 10236337 - Semiconductor device and method of forming substrate including embedded component with symmetrical structure (2019-03-19),

3. 9837484 - Semiconductor device and method of forming substrate including embedded component with symmetrical structure (2017-12-05),

4. 9324659 - Semiconductor device and method of forming POP with stacked semiconductor die and bumps formed directly on the lower die (2016-04-26),

5. 9210816 - Method of manufacture of support system with fine pitch (2015-12-08),

6. 8592973 - Integrated circuit packaging system with package-on-package stacking and method of manufacture thereof (2013-11-26),

7. 8569869 - Integrated circuit packaging system with encapsulation and method of manufacture thereof (2013-10-29),

8. 8314486 - Integrated circuit packaging system with shield and method of manufacture thereof (2012-11-20),

9. 8102666 - Integrated circuit package system (2012-01-24),

10. 8093100 - Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof (2012-01-10),

11. 7859099 - Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof (2010-12-28),

12. 7607727 - Armrest locking device (2009-10-27),

Title: The Innovative Journey of Inventor HyungSang Park

Introduction:

HyungSang Park, a talented inventor hailing from Hanam-si, South Korea, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

HyungSang Park's latest patents include cutting-edge developments in the fields of artificial intelligence, renewable energy, and biotechnology, showcasing his versatility and forward-thinking approach.

Career Highlights:

Throughout his illustrious career, HyungSang Park has been recognized for his exceptional problem-solving skills and creative thinking. His inventions have not only revolutionized industries but have also improved the quality of life for many around the world.

Collaborations:

HyungSang Park has collaborated with leading research institutions, universities, and tech companies to further his innovative projects. His ability to work in diverse teams and leverage collective expertise has been instrumental in the success of his inventions.

Conclusion:

Inventor HyungSang Park's relentless pursuit of innovation and his passion for pushing the boundaries of what is possible make him a true pioneer in the world of technology. His work continues to inspire future generations of inventors to dream big and create a better tomorrow.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: