The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2015

Filed:

Dec. 18, 2013
Applicants:

Youngdal Roh, Icheon-si, KR;

Kyounghee Park, Seoul, KR;

Dong Ju Jeon, Seoul, KR;

Hyungsang Park, Hanam-si, KR;

Inventors:

YoungDal Roh, Icheon-si, KR;

KyoungHee Park, Seoul, KR;

Dong Ju Jeon, Seoul, KR;

HyungSang Park, Hanam-si, KR;

Assignee:

STATS ChipPAC Ltd., Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 3/101 (2013.01);
Abstract

A method of manufacture of a support system includes: forming a carrier having a detachable core and a carrier foil directly on the detachable core; forming a mask directly on the carrier foil, the mask having a mask hole through the mask; forming a bottom conductive layer within the mask hole and directly on the carrier foil; forming an interior insulation layer directly on the bottom conductive layer and the mask after the bottom conductive layer is formed within the mask hole; partially removing the interior insulation layer leaving an insulation hole through the interior insulation layer; forming a conductive connector completely within the insulation hole; and forming a bottom exterior insulation layer over the bottom conductive layer and the mask.


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