Dong Ju Jeon

Title: The Innovations of Dong Ju Jeon

Introduction

Dong Ju Jeon is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of integrated circuit packaging, holding a total of 7 patents. His work has been instrumental in advancing technology in this area.

Latest Patents

Among his latest patents is an "Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereof." This invention features a dielectric core with an embedded pad, a top solder resist layer, and a device interconnect that facilitates the mounting of integrated circuit devices. Another notable patent is the "Integrated circuit packaging system with support structure and method of manufacture thereof." This patent describes a method for creating a one-layer substrate with a symmetrical structure, which includes a redistribution pad and insulation, allowing for efficient mounting of integrated circuits.

Career Highlights

Dong Ju Jeon has worked with notable companies such as Stats Chippac Pte. Ltd. and Samsung Electro-Mechanics Co., Ltd. His experience in these organizations has contributed to his expertise in integrated circuit technology.

Collaborations

He has collaborated with talented individuals in the field, including YoungDal Roh and KyoungHee Park. Their joint efforts have furthered advancements in integrated circuit packaging systems.

Conclusion

Dong Ju Jeon's innovative work in integrated circuit packaging has made a lasting impact on the industry. His patents and collaborations reflect his dedication to advancing technology in this vital area.