Stats Chippac Pte. Ltd.

Samsung Electro-mechanics Co., Ltd.

Dong Ju Jeon

KyoungHee Park

YoungDal Roh

Dong Jun Lee

Chi Seong Kim

Seong Min Cho

MinKyung Kang

Jung Youn Pang

Sung Soo Kim

JinHee Jung

Koo Hong Lee

HyungSang Park

An integrated circuit packaging system and method of manufacture thereof includes: a dielectric core having an embedded pad; a top solder resist layer on the dielectric core, a pad top surface of the embedded pad below the top solder resist layer; a device interconnect attached to the embedded pad; and an integrated circuit device having an interconnect pillar, the interconnect pillar attached to the device interconnect for mounting the integrated circuit device to the dielectric core.

Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system includes: forming a one-layer substrate with a symmetrical structure, the one-layer substrate having a redistribution pad and an insulation, the redistribution pad only at an insulation top side of the insulation; mounting an integrated circuit over the one-layer substrate; and forming an encapsulation over the integrated circuit.

Integrated circuit packaging system with support structure and method of manufacture thereof

An electroless surface treatment plated layer of a printed circuit board, a method for preparing the same, and printed circuit board including the same. The electroless surface treatment plated layer includes: electroless nickel (Ni) plated coating/palladium (Pd) plated coating/gold (Au) plated coating, wherein the electroless nickel, palladium, and gold plated coatings have thicknesses of 0.02 to 1 &#x3bc;m, 0.01 to 0.3 &#x3bc;m, and 0.01 to 0.5 &#x3bc;m, respectively. In the electroless surface treatment plated layer of the printed circuit board, a thickness of the nickel plated coating is specially minimized to 0.02 to 1 &#x3bc;m, thereby making it possible to form an optimized electroless Ni/Pd/Au surface treatment plated layer.

Electroless surface treatment plated layers of printed circuit board and method for preparing the same

A method of manufacture of a support system includes: forming a carrier having a detachable core and a carrier foil directly on the detachable core; forming a mask directly on the carrier foil, the mask having a mask hole through the mask; forming a bottom conductive layer within the mask hole and directly on the carrier foil; forming an interior insulation layer directly on the bottom conductive layer and the mask after the bottom conductive layer is formed within the mask hole; partially removing the interior insulation layer leaving an insulation hole through the interior insulation layer; forming a conductive connector completely within the insulation hole; and forming a bottom exterior insulation layer over the bottom conductive layer and the mask.

Method of manufacture of support system with fine pitch

An integrated circuit packaging system, and a method of manufacture of an integrated circuit packaging system thereof, including: an embedding material on a component; a mask layer on the embedding material; a buried pattern in the mask layer, the outer surface of the buried pattern coplanar with the outer surface of the mask layer, the buried pattern electrically connected to the component; a patterned dielectric on a portion of the buried pattern; and an integrated circuit die on the buried pattern.

Growing community of inventors

Seoul, South Korea

Dong Ju Jeon