YoungDal Roh

Title: The Innovative Mind of YoungDal Roh

Introduction

YoungDal Roh, an accomplished inventor based in Icheon-si, South Korea, holds an impressive portfolio of six patents. His work primarily focuses on advancements in integrated circuit packaging systems, which play a crucial role in modern electronics.

Latest Patents

One of YoungDal Roh's most notable inventions is an integrated circuit packaging system with an embedded pad on a layered substrate, along with its method of manufacture. This innovative system features a dielectric core with an embedded pad, a top solder resist layer on the dielectric core, and a pad top surface of the embedded pad located beneath the top solder resist layer. Additionally, the design includes a device interconnect attached to the embedded pad and an integrated circuit device that has an interconnect pillar attached to the device interconnect, allowing for effective mounting of the integrated circuit device to the dielectric core. This patent exemplifies his expertise in creating efficient and reliable packaging solutions for integrated circuits.

Career Highlights

YoungDal Roh contributes his talents at Stats Chippac Pte. Ltd., a company renowned for its advancements in semiconductor packaging. His career is marked by a series of innovations that have significantly influenced the industry, reflecting his commitment to enhancing electronic component performance.

Collaborations

Throughout his career, YoungDal Roh has worked alongside talented colleagues such as KyoungHee Park and Dong Ju Jeon. Their collaboration underscores the importance of teamwork in driving innovation and developing cutting-edge technologies in the competitive field of electronics.

Conclusion

YoungDal Roh's contributions to the field of integrated circuit packaging are invaluable. With his latest innovations, he continues to push the boundaries of technology, demonstrating the impact of dedicated inventors in shaping the future of electronics.