The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2015
Filed:
Jun. 24, 2014
Applicants:
Youngdal Roh, Icheon-si, KR;
Deokkyung Yang, Hanam-si, KR;
Heesoo Lee, Anyang-si, KR;
Inventors:
Assignee:
STATS ChipPAC Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4825 (2013.01); H01L 23/495 (2013.01); H01L 24/33 (2013.01); H01L 24/83 (2013.01);
Abstract
An integrated circuit packaging system, and a method of manufacture thereof, including: a patterned first conductive plating; a molding on the patterned first conductive plating; a through via through the molding; a second conductive plating on the molding and the through via; a protection layer partially covering the first conductive plating, the second conductive plating and the molding; a device on the first conductive plating; and an external connector being attached to the second conductive plating.