The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2012
Filed:
Feb. 23, 2010
Applicants:
Heejo Chi, Ichon-si, KR;
Namju Cho, Uiwang-si, KR;
Hyungsang Park, Hanam-si, KR;
Inventors:
Assignee:
STATS ChipPAC Ltd., Singapore, SG;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate having a component side; mounting a device over the component side; forming a shield connector on the component side adjacent the device; forming a package interconnect on the component side outside a region having the shield connector and the device; applying an encapsulant around the package interconnect, the shield connector, and the device; and mounting a shield structure on the encapsulant, the shield connector, and the device, with the package interconnect partially exposed.