The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2015
Filed:
Jun. 23, 2011
Applicants:
A Leam Choi, Ichon-si, KR;
Dongsam Park, Ichon si, KR;
Yongduk Lee, Seoul, KR;
Inventors:
Assignee:
STATS ChipPAC Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 25/10 (2006.01); H01L 25/03 (2006.01); H01L 25/00 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); H01L 21/561 (2013.01); H01L 23/49811 (2013.01); H01L 25/105 (2013.01); H01L 25/03 (2013.01); H01L 25/50 (2013.01); H01L 21/4853 (2013.01); H01L 23/3128 (2013.01); H01L 24/97 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2924/01029 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19107 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit over the substrate; forming an encapsulation over the integrated circuit, the encapsulation having an encapsulation interior sidewall; forming a peripheral non-horizontal conductive plate directly on the encapsulation interior sidewall; and forming a peripheral vertical conductor directly on the peripheral non-horizontal conductive plate and the substrate.