Company Filing History:
Years Active: 2014-2015
Title: YongDuk Lee: Innovator in Semiconductor Technology
Introduction
YongDuk Lee is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on innovative methods and devices that enhance the performance and efficiency of semiconductor systems.
Latest Patents
YongDuk Lee's latest patents include a semiconductor device and a method of embedding TSV (Through-Silicon Via) semiconductor die within a substrate for vertical interconnect in Package on Package (POP) applications. This patent describes a semiconductor device that features a substrate with a first conductive layer and multiple cavities that expose this layer. A first semiconductor die with conductive TSV is mounted into these cavities, and an insulating layer is formed to embed the die within the substrate. The design allows for efficient electrical connections and improved performance.
Another notable patent is for an integrated circuit packaging system with vertical interconnects and a method of manufacture. This patent outlines a process that involves providing a substrate, mounting an integrated circuit, and forming an encapsulation over it. The encapsulation includes a non-horizontal conductive plate and a vertical conductor, which enhances the connectivity and functionality of the integrated circuit.
Career Highlights
YongDuk Lee is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the semiconductor field. His expertise and contributions have positioned him as a key figure in the development of advanced semiconductor technologies.
Collaborations
Throughout his career, YongDuk Lee has collaborated with talented professionals, including DongSam Park and A Leam Choi. These collaborations have fostered a creative environment that encourages innovation and the advancement of semiconductor technology.
Conclusion
YongDuk Lee's work in semiconductor technology exemplifies the spirit of innovation. His patents reflect a commitment to enhancing the capabilities of semiconductor devices, making significant strides in the industry.