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For the Inventor, By the Inventor

Ichon, South Korea

DongSam Park

This inventor holds 18 USPTO granted patents and 4 published patent applications. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2007-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: DongSam Park. Retrieved from https://idiyas.com/inventor/dongsam-park

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18 

% Patents Active = 94.4

Average Co-Inventor Count = 2.6

ph-index = 6

Forward Citations = 155(Granted Patents)


Location History:

  • Seongnam-si, KR (2011 - 2013)
  • Ichon-si, KR (2007 - 2015)
  • Kyoungki-do, KR (2014 - 2015)
  • Incheon, KR (2023)

Company Filing History:

goldMedal18 out of 1,845 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2007-2024

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18 patents (USPTO):Explore Patents
1. 12107028 - Thermally enhanced FCBGA package (2024-10-01),
2. 11823973 - Package with compartmentalized lid for heat spreader and EMI shield (2023-11-21),
3. 11670563 - Thermally enhanced FCBGA package (2023-06-06),
4. 9087701 - Semiconductor device and method of embedding TSV semiconductor die within substrate for vertical interconnect in POP (2015-07-21),
5. 8970044 - Integrated circuit packaging system with vertical interconnects and method of manufacture thereof (2015-03-03),
6. 8883561 - Semiconductor device and method of embedding TSV semiconductor die within encapsulant with TMV for vertical interconnect in POP (2014-11-11),
7. 8704365 - Integrated circuit packaging system having a cavity (2014-04-22),
8. 8598034 - Package-on-package system with through vias and method of manufacture thereof (2013-12-03),
9. 8460968 - Integrated circuit packaging system with post and method of manufacture thereof (2013-06-11),
10. 8367465 - Integrated circuit package on package system (2013-02-05),
11. 8334601 - Package-on-package system with through vias and method of manufacture thereof (2012-12-18),
12. 8110905 - Integrated circuit packaging system with leadframe interposer and method of manufacture thereof (2012-02-07),
13. 8008787 - Integrated circuit package system with delamination prevention structure (2011-08-30),
14. 7989950 - Integrated circuit packaging system having a cavity (2011-08-02),
15. 7986048 - Package-on-package system with through vias and method of manufacture thereof (2011-07-26),

Title: DongSam Park: Pioneering Inventor from Ichon-si, KR

Introduction: DongSam Park is a renowned inventor hailing from Ichon-si, South Korea, known for his groundbreaking contributions to various fields of innovation.

Latest Patents: DongSam Park holds several patents in the areas of technology and engineering, showcasing his continuous dedication to pushing the boundaries of what is possible.

Career Highlights: Throughout his illustrious career, DongSam Park has worked on numerous projects that have revolutionized industries, demonstrating his exceptional skills and forward-thinking mindset.

Collaborations: DongSam Park has collaborated with leading researchers, engineers, and companies worldwide, fostering a culture of innovation and excellence in all his endeavors.

Conclusion: DongSam Park's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a trailblazing inventor in Ichon-si, KR, and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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