This inventor holds 5 USPTO granted patents. Top assignee: Chippac, Inc.. Active years: 2008-2012.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Ichon-si, KR (2008)
- Ichon, KR (2010 - 2012)
Company Filing History:
Years Active: 2008-2012
Title: The Innovations of Hun-Teak Lee
Introduction
Hun-Teak Lee is a prominent inventor based in Ichon, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on improving the efficiency and reliability of semiconductor packages.
Latest Patents
Among his latest patents is a method of manufacturing a semiconductor package that includes several innovative steps. This method involves providing a substrate, mounting a semiconductor die on the substrate, and attaching a wire interconnection between the die pad and a support pedestal. Another notable patent is the wire bond interconnection, which features a support pedestal at a bond site of the lead finger, ensuring a robust connection between the die pad and the bond finger.
Career Highlights
Hun-Teak Lee is currently employed at Chippac, Inc., where he continues to develop cutting-edge technologies in semiconductor packaging. His expertise has led to advancements that enhance the performance of electronic devices.
Collaborations
He has collaborated with notable coworkers such as Ki-Youn Jang and Jong-Kook Kim, contributing to various projects that push the boundaries of semiconductor innovation.
Conclusion
Hun-Teak Lee's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the development of more efficient electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile