Ichon, South Korea

Hun-Teak Lee


Average Co-Inventor Count = 5.0

ph-index = 3

Forward Citations = 23(Granted Patents)


Location History:

  • Ichon-si, KR (2008)
  • Ichon, KR (2010 - 2012)

Company Filing History:


Years Active: 2008-2012

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5 patents (USPTO):Explore Patents

Title: The Innovations of Hun-Teak Lee

Introduction

Hun-Teak Lee is a prominent inventor based in Ichon, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on improving the efficiency and reliability of semiconductor packages.

Latest Patents

Among his latest patents is a method of manufacturing a semiconductor package that includes several innovative steps. This method involves providing a substrate, mounting a semiconductor die on the substrate, and attaching a wire interconnection between the die pad and a support pedestal. Another notable patent is the wire bond interconnection, which features a support pedestal at a bond site of the lead finger, ensuring a robust connection between the die pad and the bond finger.

Career Highlights

Hun-Teak Lee is currently employed at Chippac, Inc., where he continues to develop cutting-edge technologies in semiconductor packaging. His expertise has led to advancements that enhance the performance of electronic devices.

Collaborations

He has collaborated with notable coworkers such as Ki-Youn Jang and Jong-Kook Kim, contributing to various projects that push the boundaries of semiconductor innovation.

Conclusion

Hun-Teak Lee's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the development of more efficient electronic devices.

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