The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2010
Filed:
Feb. 15, 2008
Hun-teak Lee, Ichon, KR;
Jong-kook Kim, Suwon, KR;
Chul-sik Kim, Ichon-si, KR;
Ki-youn Jang, Ichon-si, KR;
Rajendra D. Pendse, Fremont, CA (US);
Hun-Teak Lee, Ichon, KR;
Jong-Kook Kim, Suwon, KR;
Chul-Sik Kim, Ichon-si, KR;
Ki-Youn Jang, Ichon-si, KR;
Rajendra D. Pendse, Fremont, CA (US);
Chippac, Inc., Fremont, CA (US);
Abstract
A wire bond interconnection between a die pad and a bond finger includes a support pedestal at a bond site of the lead finger, a ball bond on the die pad, and a stitch bond on the support pedestal, in which a width of the lead finger at the bond site is less than a diameter of the support pedestal. Also, a semiconductor package including a die mounted onto and electrically connected by a plurality of wire bonds to a substrate, in which each of the wire bonds includes a wire ball bonded to a pad on the die and stitch bonded to a support pedestal on a bond site on a lead finger, and in which the width of the lead finger at the bond site is less than the diameter of the support pedestal.