This inventor holds 4 USPTO granted patents. Top assignee: Chippac, Inc.. Active years: 2008-2012.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Jungja-dong, KR (2008)
- Suwon, KR (2010 - 2012)
Company Filing History:
Years Active: 2008-2012
Title: Innovations of Jong-Kook Kim
Introduction
Jong-Kook Kim is a notable inventor based in Suwon, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on improving the efficiency and reliability of semiconductor packages.
Latest Patents
Among his latest patents is a method of manufacturing a semiconductor package. This method includes providing a substrate, mounting a semiconductor die on the substrate, and attaching a wire interconnection between the die pad and a support pedestal. Another significant patent is for a wire bond interconnection that enhances the connection between a die pad and a bond finger. This innovation includes a support pedestal at the bond site, ensuring a robust electrical connection.
Career Highlights
Jong-Kook Kim is currently employed at Chippac, Inc., where he continues to develop cutting-edge technologies in semiconductor packaging. His expertise has led to advancements that are crucial for the electronics industry.
Collaborations
He has collaborated with notable colleagues such as Hun-Teak Lee and Chul-Sik Kim, contributing to various projects that enhance semiconductor technology.
Conclusion
Jong-Kook Kim's innovative work in semiconductor technology has made a lasting impact on the industry. His patents reflect a commitment to advancing the field and improving the performance of electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile