The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2012
Filed:
Jul. 07, 2011
Hun-teak Lee, Ichon, KR;
Jong-kook Kim, Suwon, KR;
Chul-sik Kim, Ichon-si, KR;
Ki-youn Jang, Ichon-si, KR;
Rajendra D. Pendse, Fremont, CA (US);
Hun-Teak Lee, Ichon, KR;
Jong-Kook Kim, Suwon, KR;
Chul-Sik Kim, Ichon-si, KR;
Ki-Youn Jang, Ichon-si, KR;
Rajendra D. Pendse, Fremont, CA (US);
Chippac, Inc., Fremont, CA (US);
Abstract
A method of manufacture of a semiconductor package includes: providing a substrate; mounting a semiconductor die on the substrate, the semiconductor die having a die pad; mounting a lead finger on the substrate; attaching a support pedestal on sides of the lead finger; and attaching a wire interconnection between the die pad and the support pedestal, the wire interconnection having a ball bond on the die pad and a stitch bond on the support pedestal.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile