The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2012
Filed:
Dec. 04, 2008
Applicants:
Youngjoon Kim, Ichon-si, KR;
Ki Youn Jang, Ichon-si, KR;
Inventors:
YoungJoon Kim, Ichon-si, KR;
Ki Youn Jang, Ichon-si, KR;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/34 (2006.01); H01L 23/48 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate having a substrate cavity; mounting a bottom flip chip die below the substrate; mounting an internal integrated circuit die above the substrate; filling between the internal integrated circuit die and the substrate and between the bottom flip chip die and the substrate with a substance filling through the substrate cavity; and encapsulating the internal integrated circuit die with an encapsulation.