The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2013
Filed:
Sep. 16, 2011
Applicants:
OH Han Kim, Ichon-si, KR;
Ki Youn Jang, Ichon-si, KR;
Daesik Choi, Seoul, KR;
Dongsoo Moon, Ichon-si, KR;
Inventors:
Oh Han Kim, Ichon-si, KR;
Ki Youn Jang, Ichon-si, KR;
DaeSik Choi, Seoul, KR;
DongSoo Moon, Ichon-si, KR;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a routable layer having a column; mounting an integrated circuit structure in direct contact with the column; and forming a gamma connector to electrically connect the column to the integrated circuit structure.
Quick Actions:
Kim, Oh. (2013). Integrated circuit packaging system with routable underlayer and method of manufacture thereof (U.S. Patent No. 8513057). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8513057
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile