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For the Inventor, By the Inventor

Ichon-si, South Korea

DongSoo Moon

USPTO Granted Patents = 16 

Average Co-Inventor Count = 3.4

ph-index = 4

Forward Citations = 99(Granted Patents)


Location History:

  • Ichon-si, KR (2011 - 2015)
  • Kyonggi-do, KR (2012 - 2016)

Company Filing History:

goldMedal16 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2011-2016

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16 patents (USPTO):Explore Patents
1. 9324659 - Semiconductor device and method of forming POP with stacked semiconductor die and bumps formed directly on the lower die (2016-04-26),
2. 9093392 - Integrated circuit packaging system with vertical interconnection and method of manufacture thereof (2015-07-28),
3. 8884339 - Semiconductor device with bump formed on substrate to prevent ELK ILD delamination during reflow process (2014-11-11),
4. 8785251 - Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die (2014-07-22),
5. 8692365 - Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereof (2014-04-08),
6. 8609463 - Integrated circuit package system employing multi-package module techniques (2013-12-17),
7. 8569895 - Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die (2013-10-29),
8. 8519536 - Semiconductor device including bump formed on substrate to prevent extremely-low dielectric constant (ELK) interlayer dielectric layer (ILD) delamination during reflow process (2013-08-27),
9. 8513057 - Integrated circuit packaging system with routable underlayer and method of manufacture thereof (2013-08-20),
10. 8367467 - Semiconductor method of forming bump on substrate to prevent ELK ILD delamination during reflow process (2013-02-05),
11. 8211746 - Integrated circuit packaging system with lead frame and method of manufacture thereof (2012-07-03),
12. 8193036 - Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die (2012-06-05),
13. 8115293 - Integrated circuit packaging system with interconnect and method of manufacture thereof (2012-02-14),
14. 7968373 - Integrated circuit package on package system (2011-06-28),
15. 7951643 - Integrated circuit packaging system with lead frame and method of manufacture thereof (2011-05-31),

Title: **The Innovative Journey of DongSoo Moon: A Pioneering Inventor in Semiconductor Technology**

Introduction

DongSoo Moon, hailing from Ichon-si, South Korea, is a distinguished inventor recognized for his significant contributions to semiconductor technology. With an impressive portfolio of 16 patents to his name, Moon has made considerable strides in advancing the field through insightful innovations and methodologies.

Latest Patents

Among his latest patents, two notable inventions stand out. The first is a patent for a **semiconductor device and method of forming POP with stacked semiconductor die and bumps formed directly on the lower die**. This invention focuses on a semiconductor device structure where a first semiconductor wafer is mounted to a carrier, with a second semiconductor wafer added on top. The innovation allows for effective singulation of stacked semiconductor die while optimizing the areas for connectivity, making it a remarkable advancement in integrated circuit packaging.

The second patent, titled **integrated circuit packaging system with vertical interconnection and method of manufacture thereof**, outlines a method for creating an integrated circuit packaging system. This process enhances the attachment and insulation of connectors, streamlining the manufacturing of electronic components while improving performance and reliability.

Career Highlights

DongSoo Moon's professional journey is marked by his role at Stats Chippac Pte. Ltd., where he utilizes his expertise to drive innovation in semiconductor packaging. His work plays a pivotal role in the company’s commitment to developing cutting-edge solutions that meet the ever-evolving demands of the electronics industry.

Collaborations

Throughout his career, DongSoo Moon has had the privilege of collaborating with talented colleagues such as DaeSik Choi and SooMoon Park. These partnerships foster a vibrant environment of creativity and innovation, allowing them to tackle complex technological challenges collectively.

Conclusion

In conclusion, DongSoo Moon exemplifies the spirit of innovation within the semiconductor industry. His 16 patents reflect his dedication to advancing technology and his contributions continue to have a lasting impact on the field. As technology progresses, DongSoo Moon's work will undoubtedly inspire future inventors and drive the evolution of semiconductor solutions.

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