The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2013
Filed:
Mar. 16, 2007
Applicants:
Wonjun Ko, Ichon-si, KR;
Seungyun Ahn, Ichon-si, KR;
Dongsoo Moon, Ichon-si, KR;
Inventors:
Assignee:
Stats Chippac Ltd., Singapore, SG;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package system that includes: providing a first package including a first package first device and a first package second device both adjacent a first package substrate; and mounting and electrically interconnecting a second package over an electrical interconnect array formed on a substrate of the first package second device.