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For the Inventor, By the Inventor

Ichon, South Korea

SeungYun Ahn

This inventor holds 12 USPTO granted patents. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2009-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: SeungYun Ahn. Retrieved from https://idiyas.com/inventor/seungyun-ahn

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 12

% Patents Active = 100.0

Average Co-Inventor Count = 2.9

ph-index = 6

Forward Citations = 83(Granted Patents)


Location History:

  • Icheon-si, KR (2011 - 2012)
  • Ichon-si, KR (2009 - 2016)

Company Filing History:

goldMedal12 out of 1,845 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2009-2016

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12 patents (USPTO):Explore Patents
1. 9330945 - Integrated circuit package system with multi-chip module (2016-05-03),
2. 9093391 - Integrated circuit packaging system with fan-in package and method of manufacture thereof (2015-07-28),
3. 8643181 - Integrated circuit packaging system with encapsulation and method of manufacture thereof (2014-02-04),
4. 8609463 - Integrated circuit package system employing multi-package module techniques (2013-12-17),
5. 8535981 - Integrated circuit package-on-package system with underfilling structures and method of manufacture thereof (2013-09-17),
6. 8501535 - Integrated circuit package system with dual side connection and method for manufacturing thereof (2013-08-06),
7. 8258008 - Package-on-package system with via z-interconnections and method for manufacturing thereof (2012-09-04),
8. 8221583 - System for peeling semiconductor chips from tape (2012-07-17),
9. 8067306 - Integrated circuit packaging system with exposed conductor and method of manufacture thereof (2011-11-29),
10. 7884457 - Integrated circuit package system with dual side connection (2011-02-08),
11. 7863755 - Package-on-package system with via Z-interconnections (2011-01-04),
12. 7521297 - Multichip package system (2009-04-21),

Title: The Innovative Journey of SeungYun Ahn

Introduction: SeungYun Ahn, a talented inventor hailing from Ichon-si, South Korea, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: SeungYun Ahn holds several patents in the realm of electronics and software development, with his most recent inventions focusing on artificial intelligence integration in everyday devices.

Career Highlights: With a career spanning over two decades, SeungYun Ahn has worked for various tech companies, leading research teams and spearheading projects that have pushed the boundaries of technological advancements.

Collaborations: Throughout his career, SeungYun Ahn has collaborated with renowned researchers, engineers, and developers from around the world, fostering a culture of innovation and creativity in the projects he undertakes.

Conclusion: SeungYun Ahn's passion for innovation and his relentless drive to create technology that enhances the way we live and work make him a true pioneer in the field of inventions. His contributions continue to inspire future generations of inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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