The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2013
Filed:
Mar. 10, 2011
Applicants:
Chan Hoon Ko, Incheon, KR;
Seungyun Ahn, Ichon-si, KR;
Inventors:
Chan Hoon Ko, Incheon, KR;
SeungYun Ahn, Ichon-si, KR;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacturing of an integrated circuit packaging system includes: providing a bottom package in a cavity in a central region of the bottom package having inter-package interconnects in the cavity; forming a vent on an inter-package connection side of the bottom package from an exterior of the bottom package to the cavity; mounting a top package on the inter-package interconnects; and applying an underfill through the vent and into the cavity.