The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2012
Filed:
Jan. 22, 2008
Applicants:
Gab Yong Min, Ichon-Si, KR;
Dong Hyong Lee, Ichon-si, KR;
Jung Ho Kim, Yuju-gun, KR;
Seungyun Ahn, Icheon-si, KR;
Inventors:
Gab Yong Min, Ichon-Si, KR;
Dong Hyong Lee, Ichon-si, KR;
Jung Ho Kim, Yuju-gun, KR;
SeungYun Ahn, Icheon-si, KR;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Primary Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor system for peeling semiconductor chips from tape, comprising: providing an outer housing having an aperture on a top thereof; providing a magnet with a needle base extension; providing needles magnetically held to the magnet; applying a vacuum through the aperture to hold an adhesive material to the outer housing; and extending the needles through the aperture in the outer housing.