This inventor holds 1 USPTO granted patent. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2012.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2012
Title: Innovations of Dong Hyong Lee
Introduction
Dong Hyong Lee is a notable inventor based in Ichon-si, South Korea. He has made significant contributions to the field of semiconductor technology. His innovative approach has led to the development of a unique system that enhances the efficiency of semiconductor chip production.
Latest Patents
One of Dong Hyong Lee's key patents is titled "System for peeling semiconductor chips from tape." This invention involves a semiconductor system designed to peel semiconductor chips from tape effectively. The system comprises an outer housing with an aperture on the top, a magnet with a needle base extension, and needles that are magnetically held to the magnet. Additionally, it applies a vacuum through the aperture to hold an adhesive material to the outer housing while extending the needles through the aperture.
Career Highlights
Dong Hyong Lee is currently employed at Stats Chippac Pte. Ltd., a company known for its expertise in semiconductor packaging and testing. His work at this organization has allowed him to collaborate with other talented professionals in the field.
Collaborations
Some of his coworkers include Gab Yong Min and Jung Ho Kim, who contribute to the innovative environment at Stats Chippac Pte. Ltd. Their collective efforts enhance the company's capabilities in semiconductor technology.
Conclusion
Dong Hyong Lee's contributions to semiconductor technology through his innovative patent demonstrate his expertise and commitment to advancing the industry. His work continues to influence the field positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile