IDiyas

For the Inventor, By the Inventor

Sungnam-si, South Korea

WonJun Ko

USPTO Granted Patents = 17

Average Co-Inventor Count = 3.1

ph-index = 5

Forward Citations = 102(Granted Patents)


Location History:

  • Sungnam-Si, KR (2011 - 2013)
  • Ichon-si, KR (2013)
  • Sungnam-Si, KP (2015)
  • Kyungki-Do, KR (2012 - 2018)

Company Filing History:

goldMedal17 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2011-2018

Loading Chart...
17 patents (USPTO):Explore Patents
1. 10163744 - Semiconductor device and method of forming a low profile dual-purpose shield and heat-dissipation structure (2018-12-25),
2. 9279673 - Semiconductor device and method of calibrating warpage testing system to accurately measure semiconductor package warpage (2016-03-08),
3. 9252032 - Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias (2016-02-02),
4. 9076802 - Dual-sided film-assist molding process (2015-07-07),
5. 8618653 - Integrated circuit package system with wafer scale heat slug (2013-12-31),
6. 8609463 - Integrated circuit package system employing multi-package module techniques (2013-12-17),
7. 8569882 - Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof (2013-10-29),
8. 8546957 - Integrated circuit packaging system with dielectric support and method of manufacture thereof (2013-10-01),
9. 8536718 - Integrated circuit packaging system with trenches and method of manufacture thereof (2013-09-17),
10. 8524537 - Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue (2013-09-03),
11. 8415204 - Integrated circuit packaging system with heat spreader and method of manufacture thereof (2013-04-09),
12. 8263435 - Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias (2012-09-11),
13. 8227925 - Integrated circuit packaging system with interposer (2012-07-24),
14. 8124451 - Integrated circuit packaging system with interposer (2012-02-28),
15. 8067275 - Integrated circuit package system with package integration (2011-11-29),

Title: Innovations by WonJun Ko

Introduction

WonJun Ko is a prominent inventor based in Sungnam-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 17 patents. His work focuses on enhancing the efficiency and performance of semiconductor devices.

Latest Patents

Among his latest innovations, WonJun Ko has developed a semiconductor device and method of forming a low profile dual-purpose shield and heat-dissipation structure. This device features a substrate with a recess and a peripheral portion that includes through conductive vias. A first semiconductor die is mounted over the substrate and within the recess, while a planar heat spreader is positioned above it. The design includes openings around the center portion of the heat spreader, allowing for the mounting of a second semiconductor die and a third semiconductor die. Additionally, he has patented a method for calibrating a warpage testing system to accurately measure semiconductor package warpage. This system utilizes a calibration block made of two different metals to ensure precise measurements over a range of temperatures.

Career Highlights

WonJun Ko is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing the technology used in semiconductor packaging and testing.

Collaborations

He collaborates with talented coworkers, including JaEun Yun and Sungmin Song, who contribute to his projects and research efforts.

Conclusion

WonJun Ko's contributions to semiconductor technology through his numerous patents highlight his expertise and dedication to innovation. His work continues to influence the industry and pave the way for future advancements.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…