The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2015
Filed:
Sep. 25, 2013
Applicants:
Wonjun Ko, Sungnam-Si, KP;
Gwangtae Kim, Seoul, KR;
Keochang Lee, Icheon-si, KR;
Inventors:
Assignee:
STATS ChipPAC Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 21/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 21/56 (2013.01);
Abstract
Simultaneous semiconductor packages can be produced using a dual-sided film-assist molding process. The process involves using a film or membrane having opposing surfaces for receiving un-encapsulated semiconductor packages on both surfaces. A slot can be formed in the film or membrane to facilitate introduction and passage of the encapsulation therethrough such that upon removal of the film or membrane, increased throughput and productivity of the completed semiconductor packages can be carried out to achieve considerable cost savings.