GwangTae Kim

Title: GwangTae Kim: Innovator in Integrated Circuit Packaging

Introduction

GwangTae Kim is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of integrated circuit packaging, holding a total of 3 patents. His innovative work focuses on enhancing the efficiency and reliability of semiconductor devices.

Latest Patents

One of GwangTae Kim's latest patents is an integrated circuit packaging system with plated copper posts and a method of manufacture thereof. This system includes a copper film, a first metal layer directly on the copper film, and an insulation layer with a via hole. The design incorporates a conductive via, a second metal layer, and a copper post, culminating in a solder pad and an interposer. This innovative approach aims to improve the performance of integrated circuits.

Another notable patent is related to a semiconductor device and a method of calibrating a warpage testing system. This system utilizes a calibration block made of two different metals with varying coefficients of thermal expansion (CTE). The calibration block is measured over a temperature profile, allowing for accurate compensation of warpage measurements in semiconductor packages.

Career Highlights

GwangTae Kim is currently employed at Stats Chippac Pte. Ltd., where he continues to develop cutting-edge technologies in semiconductor packaging. His work has been instrumental in advancing the capabilities of integrated circuits, making them more efficient and reliable.

Collaborations

GwangTae Kim collaborates with talented coworkers, including WonJun Ko and Seong Won Park. Their combined expertise contributes to the innovative projects at Stats Chippac Pte. Ltd.

Conclusion

GwangTae Kim is a key figure in the field of integrated circuit packaging, with a focus on innovative solutions that enhance semiconductor performance. His contributions through patents and collaboration with skilled professionals underscore his impact on the industry.