The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2013
Filed:
Mar. 24, 2011
Wonjun Ko, Sungnam-Si, KR;
Sungmin Song, Inchon, KR;
Jong Wook Ju, Icheon-Si, KR;
Jaeun Yun, Ichon, KR;
Hye Ran Lee, Ichon-si, KR;
WonJun Ko, Sungnam-Si, KR;
Sungmin Song, Inchon, KR;
Jong Wook Ju, Icheon-Si, KR;
JaEun Yun, Ichon, KR;
Hye Ran Lee, Ichon-si, KR;
Stats Chippac Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; mounting a central integrated circuit over the base substrate; mounting a side package having a side package substrate along a peripheral region of the base substrate and laterally peripheral to the central integrated circuit with the side package substrate coplanar with the central integrated circuit; and encapsulating the central integrated circuit and the side package above the base substrate with a base encapsulation to form a planar surface over the central integrated circuit and the side package facing away from the base substrate.