The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2013
Filed:
Mar. 26, 2009
Applicants:
Jaeun Yun, Ichon, KR;
Jong Wook Ju, Icheon-Si, KR;
Wonjun Ko, Sungnam-Si, KR;
Hye Ran Lee, Ichon-si, KR;
Inventors:
JaEun Yun, Ichon, KR;
Jong Wook Ju, Icheon-Si, KR;
WonJun Ko, Sungnam-Si, KR;
Hye Ran Lee, Ichon-si, KR;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a package substrate; mounting an integrated circuit die on the package substrate; and attaching a heat spreader assembly, having a thermal adhesive layer formed therein, to the package substrate and the integrated circuit die.