The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2012
Filed:
Dec. 08, 2009
Dongsoo Moon, Ichon-si, KR;
Taewoo Lee, Icheon-Si, KR;
Soo-san Park, Seoul, KR;
Soomoon Park, Jinju-si, KR;
Sang-ho Lee, Yeoju, KR;
DongSoo Moon, Ichon-si, KR;
Taewoo Lee, Icheon-Si, KR;
Soo-San Park, Seoul, KR;
SooMoon Park, Jinju-si, KR;
Sang-Ho Lee, Yeoju, KR;
Stats Chippac Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a first substrate; mounting a component over the first substrate; mounting a stack substrate over the component, the stack substrate having an inner pad and an outer pad connected to the first substrate; mounting a first exposed interconnect on the outer pad; forming a first encapsulation over the stack substrate, the first exposed interconnect partially exposed and the inner pad partially exposed in a recess of the first encapsulation; and mounting a second exposed interconnect on the inner pad.