Jinju-si, South Korea

SooMoon Park

USPTO Granted Patents = 7 

Average Co-Inventor Count = 3.1

ph-index = 4

Forward Citations = 33(Granted Patents)


Location History:

  • Jinju-si, KR (2010 - 2014)
  • Kyonggi-do, KR (2012 - 2014)

Company Filing History:


Years Active: 2010-2014

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7 patents (USPTO):Explore Patents

Title: Innovations of SooMoon Park

Introduction

SooMoon Park is a notable inventor based in Jinju-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of seven patents. His work focuses on enhancing the efficiency and effectiveness of semiconductor devices.

Latest Patents

One of his latest patents is for a semiconductor device and method of forming mold underfill using a dispensing needle having the same width as the semiconductor die. This innovation allows for the precise deposition of mold underfill, ensuring an even application without the need for motion of the dispensing needle. Another significant patent involves an integrated circuit packaging system with thermal dispersal structures. This method includes the attachment of a package stack assembly and the application of encapsulation, which enhances the thermal management of integrated circuits.

Career Highlights

SooMoon Park is currently employed at Stats Chippac Pte. Ltd., where he continues to develop cutting-edge technologies in semiconductor packaging. His expertise in this area has positioned him as a key player in the industry.

Collaborations

He has collaborated with notable coworkers such as DongSoo Moon and ByoungWook Jang, contributing to various projects that advance semiconductor technology.

Conclusion

SooMoon Park's innovative work in semiconductor devices and packaging systems showcases his dedication to advancing technology in this critical field. His patents reflect a commitment to improving the efficiency and performance of electronic components.

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