The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2012
Filed:
Aug. 19, 2008
Applicants:
Soomoon Park, Jinju-si, KR;
Kyunghoon Lee, Icheon, KR;
Inventors:
SooMoon Park, Jinju-si, KR;
KyungHoon Lee, Icheon, KR;
Assignee:
STATS ChipPAC Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/24 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package system includes: providing a substrate having a top side with a trace conductor connected to a bottom side with a system interconnect; forming a bump ring on the substrate, the bump ring having an inner cavity area over the trace conductor and an outer bump area; applying a substrate mask layer adjacent a perimeter of the outer bump area; connecting a device to the trace conductor below the bump ring; and applying a compound between the device and the substrate.