The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2014
Filed:
Jun. 17, 2011
Dongsoo Moon, Ichon-si, KR;
Taewoo Lee, Yongin-si, KR;
Soo-san Park, Seoul, KR;
Soomoon Park, Jinju-si, KR;
Sang-ho Lee, Yeoju, KR;
DongSoo Moon, Ichon-si, KR;
Taewoo Lee, Yongin-si, KR;
Soo-San Park, Seoul, KR;
SooMoon Park, Jinju-si, KR;
Sang-Ho Lee, Yeoju, KR;
Stats Chippac Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; attaching a package stack assembly, having a contact pad, on the base substrate; applying an encapsulation having a cavity with a tapered side directly over the package stack assembly, the contact pad exposed in the cavity; attaching a recessed circuitry unit in the cavity and on the contact pad, a chamber of the cavity formed by the recessed circuitry unit and the tapered side of the cavity; and mounting a thermal structure over the recessed circuitry unit, the cavity, and the encapsulation.