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For the Inventor, By the Inventor

Icheon-si, South Korea

Taewoo Lee

USPTO Granted Patents = 13 

Average Co-Inventor Count = 3.2

ph-index = 5

Forward Citations = 102(Granted Patents)


Location History:

  • Yong Jun dong, KR (2010)
  • Kyounggi, KR (2010 - 2011)
  • Icheon-Si, KR (2010 - 2014)
  • Yongin-si, KR (2012 - 2015)

Company Filing History:

goldMedal13 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2010-2015

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13 patents (USPTO):Explore Patents
1. 9082887 - Integrated circuit packaging system with posts and method of manufacture thereof (2015-07-14),
2. 8692365 - Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereof (2014-04-08),
3. 8624370 - Integrated circuit packaging system with an interposer and method of manufacture thereof (2014-01-07),
4. 8502387 - Integrated circuit packaging system with vertical interconnection and method of manufacture thereof (2013-08-06),
5. 8390110 - Integrated circuit packaging system with cavity and method of manufacture thereof (2013-03-05),
6. 8258008 - Package-on-package system with via z-interconnections and method for manufacturing thereof (2012-09-04),
7. 8115293 - Integrated circuit packaging system with interconnect and method of manufacture thereof (2012-02-14),
8. 8030769 - Grooving bumped wafer pre-underfill system (2011-10-04),
9. 8017502 - Wafer system with partial cuts (2011-09-13),
10. 7863755 - Package-on-package system with via Z-interconnections (2011-01-04),
11. 7786551 - Integrated circuit system with wafer trimming (2010-08-31),
12. 7727875 - Grooving bumped wafer pre-underfill system (2010-06-01),
13. 7659140 - Integrated circuit system with a debris trapping system (2010-02-09),

Title: Innovations by Taewoo Lee in Integrated Circuit Packaging

Introduction

Taewoo Lee is a prominent inventor based in Icheon-si, South Korea. He has made significant contributions to the field of integrated circuit packaging, holding a total of 13 patents. His work focuses on innovative methods that enhance the efficiency and effectiveness of semiconductor technologies.

Latest Patents

Among his latest patents, Taewoo Lee has developed an integrated circuit packaging system with posts and a method of manufacture thereof. This method involves providing a semiconductor wafer with a chip pad, attaching a wafer frame, and forming an underfill around the protruding connector. The process culminates in the singulation of an integrated circuit package from the semiconductor wafer. Another notable patent is the integrated circuit packaging system with thermal dispersal structures. This method includes attaching a package stack assembly on a base substrate and applying an encapsulation with a cavity that has a tapered side, ensuring effective thermal management.

Career Highlights

Taewoo Lee is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the semiconductor industry. His expertise in integrated circuit packaging has positioned him as a key player in advancing technology in this field.

Collaborations

Throughout his career, Taewoo Lee has collaborated with talented individuals such as Sang-Ho Lee and Soo-San Park. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Taewoo Lee's contributions to integrated circuit packaging are noteworthy and reflect his dedication to innovation. His patents not only advance the field but also demonstrate the importance of collaboration in achieving technological breakthroughs.

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