The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2013
Filed:
Oct. 20, 2009
Applicants:
Sang-ho Lee, Yeoju, KR;
Taewoo Lee, Icheon-Si, KR;
Soo-san Park, Seoul, KR;
Inventors:
Assignee:
STATS ChipPAC Ltd., Singapore, SG;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacture of an integrated circuit packaging system includes: mounting a substrate-less integrated circuit package, having a terminal having characteristics of an intermetallic compound, over a substrate; connecting the substrate and the substrate-less integrated circuit package; and forming a base encapsulation over the substrate-less integrated circuit package with the terminal exposed.