Seoul, South Korea

Soo-San Park


Average Co-Inventor Count = 2.9

ph-index = 7

Forward Citations = 136(Granted Patents)


Company Filing History:


Years Active: 2007-2014

Loading Chart...
32 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Soo-San Park

Introduction

Soo-San Park, an esteemed inventor based in Seoul, South Korea, has made remarkable strides in the field of integrated circuit packaging systems. His innovative work has led to an impressive portfolio of 32 patents, reflecting his dedication to advancing technology in this critical area.

Latest Patents

Among his latest patents, Soo-San Park has developed an "Integrated Circuit Packaging System Having Dual Sided Connection and Method of Manufacture Thereof." This invention describes a sophisticated method for integrating circuits through a detailed process that involves mounting an integrated circuit onto a substrate, attaching a conductive support, and forming encapsulation to enhance durability and performance.

Another notable patent is the "Stacked Integrated Circuit Package System with Face to Face Stack Configuration." This innovation outlines the process for creating a first molded chip, detailing how to efficiently stack integrated circuit devices to maintain optimal connectivity while minimizing space. His contributions significantly enhance the efficiency and functionality of integrated circuits.

Career Highlights

Currently, Soo-San Park is employed at Stats Chippac Pte. Ltd., where he continues to push the boundaries of innovation in the technology sector. His extensive experience and expertise have allowed him to lead pioneering projects that set new industry standards.

Collaborations

Throughout his career, Soo-San has collaborated with talented professionals, including coworkers Sang-Ho Lee and Jong-Woo Ha. Their combined expertise has fostered a collaborative environment, encouraging groundbreaking developments in integrated circuit technology.

Conclusion

Soo-San Park's contributions to the field of integrated circuit packaging are invaluable. With 32 patents to his name and a commitment to innovation, he remains a vital figure in advancing the technology landscape. His work has not only impacted his company but has also influenced the industry at large, showcasing the importance of creativity and collaboration in driving technological progress.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…