The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2013
Filed:
Dec. 21, 2010
Applicants:
Daesik Choi, Seoul, KR;
Bumjoon Hong, Seoul, KR;
Sang-ho Lee, Yeoju, KR;
Jong-woo Ha, Seoul, KR;
Soo-san Park, Seoul, KR;
Inventors:
DaeSik Choi, Seoul, KR;
BumJoon Hong, Seoul, KR;
Sang-Ho Lee, Yeoju, KR;
Jong-Woo Ha, Seoul, KR;
Soo-San Park, Seoul, KR;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for manufacturing an integrated circuit package system includes: providing a base package including a first integrated circuit coupled to a base substrate by an electrical interconnect formed on one side; and mounting an offset package over the base package, the offset package electrically coupled to the base substrate via a system interconnect.