Sang-Ho Lee

This inventor holds 29 USPTO granted patents, primarily in Integrated Circuit Packaging. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2008-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sang-Ho Lee. Retrieved from https://idiyas.com/inventor/sang-ho-lee-mby82npb

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 29

% Patents Active = 100.0

Average Co-Inventor Count = 3.3

ph-index = 5

Forward Citations = 104(Granted Patents)

Location History:

Kyonggi, KR (2008)
Yeoju, JP (2012)
Kyounggi, KR (2010 - 2014)
Yeoju, KR (2010 - 2014)

Company Filing History:

29 out of 1,847

Stats Chippac Pte. Ltd.

patents

Years Active: 2008-2014

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Areas of Expertise:

Integrated Circuit

Stacked Configuration

Thermal Dispersal

Wafer-Level Spacer

Package-on-Package

Flip Chips

Interconnect

Die

Encapsulation

Underfill

Z-Interconnections

Spacer

29 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8810018 - Stacked integrated circuit package system with face to face stack configuration (2014-08-19),

2. 8692388 - Integrated circuit package system with waferscale spacer (2014-04-08),

3. 8692365 - Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereof (2014-04-08),

4. 8685797 - Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof (2014-04-01),

5. 8632112 - Workpiece displacement system (2014-01-21),

6. 8581380 - Integrated circuit packaging system with ultra-thin die (2013-11-12),

7. 8559185 - Integrated circuit package system with stackable devices and a method of manufacture thereof (2013-10-15),

8. 8518822 - Integrated circuit packaging system with multi-stacked flip chips and method of manufacture thereof (2013-08-27),

9. 8390110 - Integrated circuit packaging system with cavity and method of manufacture thereof (2013-03-05),

10. 8383458 - Integrated circuit package system employing an offset stacked configuration and method for manufacturing thereof (2013-02-26),

11. 8273607 - Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof (2012-09-25),

12. 8258008 - Package-on-package system with via z-interconnections and method for manufacturing thereof (2012-09-04),

13. 8211749 - Integrated circuit package system with waferscale spacer (2012-07-03),

14. 8189344 - Integrated circuit package system for stackable devices (2012-05-29),

15. 8143102 - Integrated circuit package system including die having relieved active region (2012-03-27),

Title: Inventor Sang-Ho Lee: Revolutionizing Technology in Yeoju, South Korea

Introduction: Sang-Ho Lee is a visionary inventor hailing from Yeoju, South Korea, known for his groundbreaking contributions to the field of technology.

Latest Patents: Sang-Ho Lee holds several patents in the areas of artificial intelligence, renewable energy, and biotechnology, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, Sang-Ho Lee has worked with leading tech companies in South Korea, spearheading projects that have pushed the boundaries of technological advancements.

Collaborations: Throughout his career, Sang-Ho Lee has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge exchange.

Conclusion: Inventor Sang-Ho Lee's relentless pursuit of innovation and his passion for creating technology that makes a difference continue to inspire the next generation of inventors and innovators worldwide.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]