The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2012
Filed:
Dec. 27, 2007
Applicants:
Youngjoon Kim, Ichon-si, KR;
Soo-san Park, Seoul, KR;
Inventors:
YoungJoon Kim, Ichon-si, KR;
Soo-San Park, Seoul, KR;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A mountable integrated circuit package system comprising: mounting a first integrated circuit device over a package carrier; mounting an interposer including a central aperture over the package carrier, an intra-stack interconnect connected between the interposer and the package carrier, and the first integrated circuit device within the central aperture; and forming an intra-stack encapsulation over the package carrier and surrounding the interposer.