The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2013
Filed:
Dec. 09, 2010
Daesik Choi, Seoul, KR;
Taewoo Lee, Yongin-si, KR;
Kyuwon Lee, Ansung-Si, KR;
Sungwon Cho, Icheon-si, KR;
DaeSik Choi, Seoul, KR;
Taewoo Lee, Yongin-si, KR;
KyuWon Lee, Ansung-Si, KR;
SungWon Cho, Icheon-si, KR;
Stats Chippac Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system includes: forming an outer contact pad having an outer pad top side; mounting an integrated circuit above the outer pad top side; forming an encapsulation having an encapsulation top side and an encapsulation bottom side, the encapsulation over the integrated circuit with the encapsulation bottom side coplanar with the outer pad top side; and forming a vertical interconnect through the encapsulation, the vertical interconnect having an interconnect bottom side directly on the outer pad top side and an interconnect top side exposed from the encapsulation.