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For the Inventor, By the Inventor

Kyoungki-do, South Korea

KyuWon Lee

USPTO Granted Patents = 16 

Average Co-Inventor Count = 4.6

ph-index = 7

Forward Citations = 154(Granted Patents)


Location History:

  • Ansung-Si, KR (2010 - 2015)
  • Kyoungki-Do, KR (2012 - 2016)
  • Kyunggi-do, KR (2023)

Company Filing History:

goldMedal15 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents
silverMedal1 out of 3 
 
Stat Chippac Ltd.
 patents

Years Active: 2010-2023

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16 patents (USPTO):Explore Patents
1. 11764136 - Semiconductor device and method of forming bump pad array on substrate for ground connection for heat sink/shielding structure (2023-09-19),
2. 9401347 - Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV (2016-07-26),
3. 9082887 - Integrated circuit packaging system with posts and method of manufacture thereof (2015-07-14),
4. 8937371 - Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV (2015-01-20),
5. 8932908 - Semiconductor device and method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die (2015-01-13),
6. 8574964 - Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape (2013-11-05),
7. 8531012 - Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV (2013-09-10),
8. 8519544 - Semiconductor device and method of forming WLCSP structure using protruded MLP (2013-08-27),
9. 8502392 - Semiconductor device with partially-etched conductive layer recessed within substrate for bonding to semiconductor die (2013-08-06),
10. 8502387 - Integrated circuit packaging system with vertical interconnection and method of manufacture thereof (2013-08-06),
11. 8432028 - Integrated circuit packaging system with package-on-package and method of manufacture thereof (2013-04-30),
12. 8310038 - Integrated circuit packaging system with embedded conductive structure and method of manufacture thereof (2012-11-13),
13. 8288202 - Method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die (2012-10-16),
14. 8273604 - Semiconductor device and method of forming WLCSP structure using protruded MLP (2012-09-25),
15. 8004093 - Integrated circuit package stacking system (2011-08-23),

Title: KyuWon Lee: Innovator in Semiconductor Technology

Introduction

KyuWon Lee is a prominent inventor based in Kyoungki-do, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 16 patents. His innovative work focuses on enhancing the performance and efficiency of semiconductor devices.

Latest Patents

KyuWon Lee's latest patents include a semiconductor device and method of forming a bump pad array on a substrate for ground connection for heat sink/shielding structure. This invention features a substrate with a plurality of first bumps arranged in an array, along with an array of second bumps positioned on at least two sides of the first bumps. An electrical component is placed over the first bumps, and a package structure is coupled to the array of second bumps, which includes a material that functions as a heat sink or shielding layer. The design ensures that the first and second bumps have similar dimensions, allowing for efficient manufacturing.

Another notable patent involves a semiconductor device and method of forming a shielding layer over a semiconductor die situated in a cavity of an interconnect structure. This invention includes a first semiconductor die mounted in a cavity, with a shielding layer grounded through a through-silicon via (TSV) to block electromagnetic interference. A second semiconductor die is also connected to the shielding layer, enhancing the overall functionality of the device.

Career Highlights

Throughout his career, KyuWon Lee has worked with notable companies such as Stats Chippac Pte. Ltd. and STATS CHIPPAC LTD. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

KyuWon Lee has collaborated with talented individuals in the field, including JinGwan Kim and JiHoon Oh. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

KyuWon Lee's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the industry. His work continues to influence advancements in the field, showcasing the importance of innovation in technology.

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