The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2013
Filed:
Mar. 21, 2011
Jingwan Kim, Seoul, KR;
Kyuwon Lee, Ansung-Si, KR;
Moonki Jeong, Icheon-si, KR;
Sunyoung Chun, Suwon-Si, KR;
Jihoon OH, Suwon, KR;
JinGwan Kim, Seoul, KR;
KyuWon Lee, Ansung-Si, KR;
MoonKi Jeong, Icheon-si, KR;
SunYoung Chun, Suwon-Si, KR;
JiHoon Oh, Suwon, KR;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate having a base substrate top side; mounting a base integrated circuit over the base substrate top side, the base integrated circuit having an active side opposite an inactive side with the inactive side facing the base substrate top side; attaching a peripheral interconnect to the base substrate top side and a device peripheral pad of the base integrated circuit at the active side; mounting an interposer over the base integrated circuit and the peripheral interconnect, the interposer having an interposer top side and a window; and attaching a central interconnect to the interposer top side and a device central pad of the base integrated circuit at the active side, the central interconnect through the window.