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For the Inventor, By the Inventor

Seoul, South Korea

JinGwan Kim

USPTO Granted Patents = 15

Average Co-Inventor Count = 3.8

ph-index = 6

Forward Citations = 113(Granted Patents)


Location History:

  • Icheon-si, KR (2011)
  • Kyoungki-do, KR (2011 - 2015)
  • Seoul, KR (2012 - 2016)

Company Filing History:

goldMedal15 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2011-2016

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15 patents (USPTO):Explore Patents
1. 9401347 - Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV (2016-07-26),
2. 9379064 - Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die (2016-06-28),
3. 9048209 - Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die (2015-06-02),
4. 8937371 - Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV (2015-01-20),
5. 8932908 - Semiconductor device and method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die (2015-01-13),
6. 8836114 - Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers (2014-09-16),
7. 8531012 - Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV (2013-09-10),
8. 8502392 - Semiconductor device with partially-etched conductive layer recessed within substrate for bonding to semiconductor die (2013-08-06),
9. 8476135 - Integrated circuit packaging system with vertical interconnects and method of manufacture thereof (2013-07-02),
10. 8432028 - Integrated circuit packaging system with package-on-package and method of manufacture thereof (2013-04-30),
11. 8343810 - Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers (2013-01-01),
12. 8310038 - Integrated circuit packaging system with embedded conductive structure and method of manufacture thereof (2012-11-13),
13. 8288202 - Method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die (2012-10-16),
14. 8004093 - Integrated circuit package stacking system (2011-08-23),
15. 8003496 - Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die (2011-08-23),

Title: Innovation and Ingenuity: The Patents of JinGwan Kim

Introduction

JinGwan Kim, a notable inventor based in Seoul, South Korea, has made significant contributions to the field of semiconductor technology. With a remarkable portfolio of 15 patents, Kim's innovative solutions are paving the way for advancements in how semiconductor devices are designed and manufactured.

Latest Patents

Among JinGwan Kim's latest inventions are two groundbreaking patents related to semiconductor devices. The first patent describes a semiconductor device and method for forming a shielding layer over a semiconductor die situated within a cavity of an interconnect structure. This design leverages a shielding layer that effectively blocks electromagnetic interference, essential for maintaining the integrity of semiconductor performance.

The second patent details a novel method of mounting a semiconductor die to a heat spreader on a temporary carrier. This innovative approach ensures that the heat spreader dissipates excess heat from the semiconductor die while also providing necessary electrical connections through a well-structured insulating and conductive layer system.

Career Highlights

JinGwan Kim’s career is significantly marked by his role at Stats Chippac Pte. Ltd., where he has led efforts to develop and refine semiconductor technologies. His expertise is instrumental in pushing the boundaries of what is possible in the semiconductor industry, reflecting his commitment to innovation and excellence.

Collaborations

Throughout his career, JinGwan Kim has collaborated with talented colleagues, including JiHoon Oh and KyuWon Lee. Together, they have worked on various projects that exemplify teamwork and shared innovation, contributing to their organization’s success and leading to numerous advancements in semiconductor applications.

Conclusion

In summary, JinGwan Kim stands out as a distinguished inventor whose work not only reflects technical proficiency but also a deep understanding of the evolving needs of the semiconductor industry. Through his numerous patents and collaborative efforts, Kim is leaving an indelible mark on technology that will benefit future innovations.

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