The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2011
Filed:
Aug. 01, 2008
Jihoon OH, Icheon-si, KR;
Jingwan Kim, Icheon-si, KR;
Jaehyun Lim, Seoul, KR;
Sunyoung Chun, Icheon-si, KR;
Kyuwon Lee, Ansung-Si, KR;
Sinjae Lee, Icheon-si, KR;
Jongvin Park, Seoul, KR;
JiHoon Oh, Icheon-si, KR;
JinGwan Kim, Icheon-si, KR;
Jaehyun Lim, Seoul, KR;
SunYoung Chun, Icheon-si, KR;
KyuWon Lee, Ansung-Si, KR;
SinJae Lee, Icheon-si, KR;
JongVin Park, Seoul, KR;
Stats Chippac Ltd., Singapore, SG;
Abstract
An integrated circuit package stacking system includes: forming a flexible substrate by: providing an insulating material, forming a stacking pad on the insulating material, forming a coupling pad on the insulating material, and forming a trace between the stacking pad and the coupling pad; providing a package substrate; coupling an integrated circuit to the package substrate; and applying a conductive adhesive on the package substrate for positioning the flexible substrate over the integrated circuit and coupling the flexible substrate on the conductive adhesive.