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For the Inventor, By the Inventor

Kyoungki-do, South Korea

JiHoon Oh

USPTO Granted Patents = 14

Average Co-Inventor Count = 3.8

ph-index = 7

Forward Citations = 133(Granted Patents)


Location History:

  • Icheon-si, KR (2010 - 2011)
  • Suwon, KR (2012 - 2014)
  • Kyoungki-do, KR (2011 - 2016)

Company Filing History:

goldMedal14 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2010-2016

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14 patents (USPTO):Explore Patents
1. 9401347 - Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV (2016-07-26),
2. 9379064 - Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die (2016-06-28),
3. 9048209 - Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die (2015-06-02),
4. 8937371 - Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV (2015-01-20),
5. 8836114 - Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers (2014-09-16),
6. 8709932 - Integrated circuit packaging system with interconnects and method of manufacture thereof (2014-04-29),
7. 8569870 - Integrated circuit packaging system with shielding spacer and method of manufacture thereof (2013-10-29),
8. 8531012 - Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV (2013-09-10),
9. 8432028 - Integrated circuit packaging system with package-on-package and method of manufacture thereof (2013-04-30),
10. 8343810 - Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers (2013-01-01),
11. 8310038 - Integrated circuit packaging system with embedded conductive structure and method of manufacture thereof (2012-11-13),
12. 8004093 - Integrated circuit package stacking system (2011-08-23),
13. 8003496 - Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die (2011-08-23),
14. 7683469 - Package-on-package system with heat spreader (2010-03-23),

Title: **The Innovations of JiHoon Oh: A Pioneer in Semiconductor Technology**

Introduction: JiHoon Oh, an accomplished inventor based in Kyoungki-do, South Korea, holds an impressive portfolio of 14 patents, showcasing his expertise in semiconductor technology. His innovative approach has led to advancements that enhance the performance and functionality of semiconductor devices.

Latest Patents: Among his notable patents, JiHoon Oh has developed a cutting-edge semiconductor device that features a method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure. This innovative device incorporates a first semiconductor die mounted in the cavity with a first through-silicon via (TSV), which is essential for grounding and blocking electromagnetic interference. The shielding layer, secured with an adhesive layer, allows efficient functionality while minimizing inter-device interference. Another significant patent involves a method of mounting a semiconductor die to a heat spreader on a temporary carrier. This design enhances heat dissipation and adds a layer of shielding from inter-device interference, showcasing JiHoon Oh’s commitment to advancing semiconductor technologies.

Career Highlights: JiHoon Oh currently works at Stats Chippac Pte. Ltd., a renowned company in the semiconductor industry. His work concentrates on developing innovative solutions that enhance the efficiency and performance of electronic components. With a dedication to research and development, he has made substantial contributions to semiconductor device technology.

Collaborations: Throughout his career, JiHoon Oh has collaborated with talented colleagues, including JinGwan Kim and SinJae Lee. These partnerships have fostered a productive environment where groundbreaking ideas are shared and developed, leading to numerous successful innovations in the field.

Conclusion: JiHoon Oh’s contributions to semiconductor technology have significantly impacted the industry. With 14 patents to his name, he continues to pave the way for advancements that not only improve device performance but also address critical challenges in electromagnetic interference and heat management. His innovative spirit and collaborative efforts exemplify the essence of modern invention in the rapidly evolving world of technology.

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