The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2010
Filed:
May. 30, 2008
Applicants:
Jihoon OH, Icheon-si, KR;
Kyuwon Lee, Ansung-Si, KR;
Jaehyun Lim, Seoul, KR;
Jongvin Park, Seoul, KR;
Sinjae Lee, Icheon-si, KR;
Inventors:
JiHoon Oh, Icheon-si, KR;
KyuWon Lee, Ansung-Si, KR;
Jaehyun Lim, Seoul, KR;
JongVin Park, Seoul, KR;
SinJae Lee, Icheon-si, KR;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/495 (2006.01); H01L 23/10 (2006.01); H01L 23/34 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A package-on-package system includes: providing a base substrate; mounting an integrated circuit on the base substrate; positioning a stacking interposer over the integrated circuit; and forming a heat spreader base around the integrated circuit by coupling the base substrate and the stacking interposer to the heat spreader base.