Seoul, South Korea

JongVin Park


Average Co-Inventor Count = 4.7

ph-index = 2

Forward Citations = 61(Granted Patents)


Company Filing History:


Years Active: 2010-2013

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4 patents (USPTO):Explore Patents

Title: JongVin Park - Innovator in Integrated Circuit Packaging

Introduction

JongVin Park is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of integrated circuit packaging, holding a total of 4 patents. His innovative approaches have advanced the technology used in electronic devices.

Latest Patents

One of JongVin Park's latest patents is an "Integrated circuit packaging system with shielding spacer and method of manufacture thereof." This patent outlines a method for manufacturing an integrated circuit packaging system that includes providing a substrate, mounting a bottom integrated circuit over the substrate, and connecting a bottom interconnect between the bottom integrated circuit and the substrate. Additionally, it involves mounting a bottom shield-spacer above the bottom integrated circuit, which includes a bottom shield plate, a bottom shield pillar, and a protuberance extending vertically above the bottom shield pillar.

Another notable patent is the "Integrated circuit packaging system with embedded conductive structure and method of manufacture thereof." This invention describes a method that includes providing a package carrier, mounting an integrated circuit device to the package carrier, and incorporating an embeddable conductive structure. The structure features a non-horizontal portion and a hole, which is mounted to the integrated circuit device, enhancing the overall functionality of the packaging system.

Career Highlights

JongVin Park is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the field of integrated circuit technology. His work has been instrumental in developing advanced packaging solutions that meet the demands of modern electronics.

Collaborations

Throughout his career, JongVin has collaborated with talented individuals such as JiHoon Oh and KyuWon Lee. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

JongVin Park's contributions to integrated circuit packaging have established him as a key figure in the industry. His innovative patents and collaborative efforts continue to shape the future of electronic device technology.

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