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For the Inventor, By the Inventor

Kyoungki-do, South Korea

SinJae Lee

USPTO Granted Patents = 11

Average Co-Inventor Count = 3.8

ph-index = 7

Forward Citations = 125(Granted Patents)


Location History:

  • Icheon-si, KR (2010 - 2013)
  • Kyoungki-do, KR (2011 - 2016)

Company Filing History:

goldMedal11 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2010-2016

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11 patents (USPTO):Explore Patents
1. 9401347 - Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV (2016-07-26),
2. 9379064 - Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die (2016-06-28),
3. 9048209 - Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die (2015-06-02),
4. 8937371 - Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV (2015-01-20),
5. 8836114 - Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers (2014-09-16),
6. 8569870 - Integrated circuit packaging system with shielding spacer and method of manufacture thereof (2013-10-29),
7. 8531012 - Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV (2013-09-10),
8. 8343810 - Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers (2013-01-01),
9. 8004093 - Integrated circuit package stacking system (2011-08-23),
10. 8003496 - Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die (2011-08-23),
11. 7683469 - Package-on-package system with heat spreader (2010-03-23),

Title: Innovations by Inventor SinJae Lee

Introduction

SinJae Lee is a prominent inventor based in Kyoungki-do, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 11 patents. His work focuses on enhancing the performance and reliability of semiconductor devices.

Latest Patents

One of SinJae Lee's latest patents involves a semiconductor device and a method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure. This innovative design includes a first semiconductor die mounted in a cavity, with a shielding layer that blocks electromagnetic interference. The shielding layer is secured to the semiconductor die and grounded through a TSV (Through-Silicon Via) to ensure optimal performance.

Another notable patent describes a semiconductor device that mounts a semiconductor die to a heat spreader on a temporary carrier. This invention features a heat spreader that dissipates heat from the semiconductor die while providing shielding from inter-device interference. The design includes multiple insulating and conductive layers that enhance the device's functionality.

Career Highlights

SinJae Lee is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the semiconductor industry. His work has been instrumental in developing advanced semiconductor technologies that meet the demands of modern electronics.

Collaborations

Throughout his career, SinJae Lee has collaborated with talented individuals such as JiHoon Oh and JinGwan Kim. These partnerships have contributed to the successful development of his patented technologies.

Conclusion

SinJae Lee's contributions to semiconductor technology through his innovative patents demonstrate his expertise and commitment to advancing the field. His work continues to influence the industry and pave the way for future innovations.

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