The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2015
Filed:
Dec. 10, 2010
Sungwon Cho, Icheon-si, KR;
Johyun Bae, Seoul, KR;
Daesik Choi, Seoul, KR;
Dongsoo Moon, Ichon-si, KR;
SungWon Cho, Icheon-si, KR;
JoHyun Bae, Seoul, KR;
DaeSik Choi, Seoul, KR;
DongSoo Moon, Ichon-si, KR;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having a package substrate bottom side, a package substrate top side, and a package substrate window; mounting a base integrated circuit over the package substrate, the base integrated circuit having a base inactive side and a base active side facing the package substrate top side; attaching a lower internal connector to the base active side and the package substrate bottom side, the lower internal connector through the package substrate window; forming an upper insulation conformal to the base integrated circuit and the package substrate top side, the upper insulation having an upper insulation top side; and forming a peripheral through-insulation connector through the upper insulation, the peripheral through-insulation connector having a peripheral connector bottom side directly on the package substrate top side and a peripheral connector top side coplanar with the upper insulation top side.