The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2012
Filed:
Dec. 22, 2006
Applicants:
Ki Youn Jang, Ichon-si, KR;
Sungmin Song, Inchon, KR;
Johyun Bae, Seoul, KR;
Inventors:
Assignee:
Stats Chippac Ltd., Singapore, SG;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package system that includes: providing a support structure including an integrated circuit and an electrical contact adjacent thereto; providing a first mold having a first cavity with a projection and a recess for collecting flash; engaging the first mold on the support structure with the first cavity over at least a portion of the integrated circuit and the projection and the recess between the at least a portion of the integrated circuit and the electrical contact; and injecting encapsulation material into the first cavity.